INFLUENCE OF POLYMER AGING ON RELIABILITY
INDICES OF A TYPICAL PRINTED-CIRCUIT ASSEMBLY
OF RADIOELECTRONIC EQUIPMENT

G. V. Kuznetsov and E. V. Kravchenko

UDC 621.192.3

Mathematical modeling of nonlinear nonstationary temperature 
fields of a typical printed-circuit assembly of radioelectronic equipment 
has been performed in a three-dimensional formulation with account 
for the convective and radiative heat exchange with the environment. 
On the basis of the data of the numerical experiment the "aging" 
(degradation) indices of polymer materials under prolonged thermal 
action have been determined. It has been established that the reliability 
of an object modeled with account for the real temperature fields is five 
times lower compared to the realization of normalized thermal conditions.

Tomsk State University of Control Systems and Radio Electronics, 
40 Lenin Ave., Tomsk, 634045, Russia; email: kew208@mail.ru. Translated 
from Inzhenerno-Fizicheskii Zhurnal, Vol. 80, No. 5, pp. 188-191, 
September-October, 2007. Original article submitted February 7, 
2006; revision submitted December 12, 2006.