CALCULATION OF THE TEMPERATURE FIELD OF A PRINTED-CIRCUIT
BOARD WITH ACCOUNT FOR CONVECTIVE AND RADIATIVE HEAT EXCHANGE
ON THE BOARD SURFACE

V. P. Alekseev, G. V. Kuznetsov, and S. V. Shloma

UDC 621.192.3

The temperature field of a printed-circuit board has been 
simulated numerically according to the two-dimensional thermal model 
with account for convective and radiative heat exchange on the board 
surface. The temperature fields in the actual printed-circuit board 
have been determined experimentally. The deviation of the results 
of the numerical analysis from the experimental data does not exceed 
± 4oC.

Tomsk State University of Control Systems and Radioelectronics, 
Tomsk, Russia; email: kipr@tusur.ru. Translated from Inzhenerno-Fizicheskii 
Zhurnal, Vol. 75, No. 5, pp. 177-179, September-October, 2002. 
Original article submitted October 15, 2001; revision submitted December 
26, 2001.

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